• About Us
  • Company
  • Executive Team
  • Board of Directors
  • Technical Advisory Board
  • Company Background
• CMOx™ Technology
  • CMOx™ Memory Technology
  • 0.5F² Memory Cell
  • Intellectual Property
  • CMOx™ Demonstration
• BEOL Memory™
  • Overview
  • New Business Model
  • Commercialization
• Applications
  • Storage-Class Memory
  • Memory Hierarchy
  • Product Roadmap
• News & Events

What is BEOL Memory™

Unity Semiconductor’s CMOx™ memory technology makes possible a new business model for those semiconductor memory manufacturers who are willing to innovate.

Because CMOx™ doesn’t require a transistor in the memory cell, no longer must memory products be manufactured in expensive custom memory fabs. Rather, Unity Semiconductor’s BEOL Memory™ starts the manufacturing flow in standard CMOS logic foundries, where the base wafers are fabricated on trailing-edge technology at the lowest possible cost. Then the base wafers are transferred to a BEOL Memory™ fab where multiple CMOx™ memory layers are fabricated on top of the base wafer using a standard metallization process.

Unity Semiconductor’s shrink path strategy is unique in that it enables lower base substrate cost of manufacturing, i.e., it can utilize “trailing-edge” 90nm production lines , enabling older CMOS logic production lines to serve as its base wafer foundry. No new investment in base wafer processing is needed.

(BEOL = back-end-of-line)